Up to 1/2 r_DS(on) reduction with breakthrough double sided-cooling package

Dual heat dissipation paths double current density (>60 A)

Fixed footprint and pad layout across family

Easy handling provides high yield and reliability
for high volume production

More info >    PolarPAK® (4)         Multiple Sources Available

3-W maximum power dissipation in compact 3-mm x 1.8-mm footprint increases power density, save space

• 1/5 SO-8 footprint, 1/2 SO-8 profile, same 3-W maximum power dissipation
• 2/3 TSOP-6 footprint, 3/4 TSOP-6 profile, 75 % lower thermal resistance
• N-Ch r_DS(on) ≥ 15 mΩ; P-Ch r_DS(on) ≥ 21 mΩ

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PowerPAK® ChipFET®

MOSFETs With V_GS = 1.2-V On-Resistance Rating - Industry's First

• On-resistance ratings at Vgs = 1.2 V align MOSFET turn-on voltage with 1.2 V and 1.3 V digital ICs
• Ultra-low on-resistance at 1.2 V and 1.5 V ratings
• Single n- and p-channel device options
• Ultra-small packages, down to 1.5 mm x 1.5 mm
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  1.2 V Rated On-Resistance MOSFETs
  1.5 V Rated On-Resistance MOSFETs

MOSFET FEA Thermal Simulation Tool

• Save simulations for further use & modifications
• Modeling for MOSFETs can include effect of other heat dissipating components
• Setups include: power profile, heat sink, PCB, system temp., air flow and more
• PDF report supplied with thermal images and temperature data can be downloaded to Excel

Product Overview >    Press Release >    Go to thermal simulation