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Breakthrough Package Brings High Reliability to Double Sided-Cooling
Dual Thermal Paths
Top (1°C/W) and bottom (1°C/W) cooling provides dual
heat dissipation paths for forced air applications in SO-8 footprint
Up to 48% lower on-resistance and up to 12% lower on-resistance x gate charge
Leadframe-Based Packaging
Plastic encapsulation provides easy handling & good die
protection for high assembly yield & reliability
Fixed footprint and pad layout across family
Multi-sources available
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