| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
 |  | | | | | | | | |
| CRCA12E & S |  | Thick Film | Thick Film Array, Resistor / Capacitor, Choice of Dielectric Characteristics X7R or Y5U, Wrap around termination | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 2012 | 10 | 1 M |
| 2512 |
| CRCC1206 | | Thick Film | Choice of Dielectric Characteristics (X7R or Y5U), Wraparound Termination, Thick Film R/C Element, Inner Electrode Protection, Flow & Reflow Solderable, Automatic Placement Capability, Standard Size | Resistor/Capacitor Networks | 200 | 5 | 0.125 | 1206 | 10 | 1 M |
| CSC | | Thick Film | Thick Film Resistor Networks, Single In Line, Coated SIP, Resistor Elements Protected by Tough Epoxy Conformal Coating, Available in Bag or Tube Pack | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| DFP14 and DFP16 | | Thick Film | Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test | Resistor Networks | 100 | 2 | | | 10 | 1 M |
| MDP14 and MDP16 | | Thick Film, Molded | Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack | Resistor Networks | 100 | 1 | 0.125 | | 10 | 2.2 M |
| |
| 0.25 | 10 | 2.2 M |
| MDP16-45 and MDP16-46 | | Thick Film, Molded | Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs | Resistor Networks | 100 | 2 | 0.125 | MDP1645 | | |
| 150 | 5 | MDP1646 |
| MDRC | | Thick Film | Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs | Resistor/Capacitor Networks | 100 | 2 | 2 | | 50 | 50 |
| 68 | 68 |
| 75 | 75 |
| 81 | 81 |
| 100 | 100 |
| 121 | 121 |
| 130 | 130 |
| 162 | 162 |
| 195 | 195 |
| 260 | 260 |
| 510 | 510 |
| |
| MSP | | Thick Film | Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible | Resistor Networks | 100 | 1 | 0.2 | | 10 | 2.2 M |
| 0.25 |
| 0.3 |
| 0.4 |
| SIL-HR | | Thick Film | High Reliability Network Resistors, Thick Film Technology | Resistor Networks | | 2 | 0.1 | | 46.4 | 1 M |
| 0.18 |
| 0.5 |
| 0.7 |
| 0.8 |
| 0.9 |
| SOGC 01,03,05 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | Resistor Networks | 100 | 1 | 1.6 | | 10 | 1 M |
| 2 |
| SOGC, 45 and 46 Schematics | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics | Resistor Networks | 100 | 2 | 1.6 | | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| 2 | 150 | 150 |
| 180 | 180 |
| 270 | 270 |
| 330 | 330 |
| 820 | 820 |
| SOMC | | Thick Film | Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, | Resistor Networks | 100 | 1 | 0.08 | | 10 | 1 M |
| 0.16 |
| | | Zero ohm jumper | Zero ohm jumper |
| |
| T16L08, T16LR8 | | Thick Film | Dual-In-Line, 8 Bit, R/2R Ladder Network for D/A and A/D Converter with Bi-Polar or CMOS Switches | Resistor Networks, Ladder | 100 | | | | 25 K | 100 K |
| Series | Technology | Description | Type | Typical TCR (ppm/C) | Min. tolerance (%) | Power (W) | Case (EIA & Mil) | Resistance (min) (Ohms) | Resistance (max) (Ohms) |
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