Build-to-Print Services for Patterned Thin Film Substrates

• Vishay offers build-to-print services for patterned Thin Film substrates for a wide range of materials and metallization schemes.
• Substrate options include alumina, aluminum nitride, beryllium oxide, quartz, silicon, ferrites, and titantes.
• Metallization choices include nichrome, tantalum nitride, titanium, tungsten, copper, nickel, gold and aluminum with integrated resistors, vias, wraparounds, double-sided patterning, and air-bridges.

More Info:

HDI: Thin Film Substrate High-Density Integration

• High-quality pattern substrates
• Enhanced signal routing using plated or filled vias
• Size reduction via multilayer integration up to seven layers
• Improved response conditioning with five material choices at frequencies over 100 MHz
• Applications include: RF amplifiers, high-frequency filters, microwave circuitry, airbridge and lange couplers, and optical submounts

HDI Design Guidelines